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Main Applications
Cooling for small semiconductor chips, Hot-side heat dissipation of thermoelectric coolers, Server chip cooling
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System Features
Compact size, ideal for single-chip cooling solutions, Chip is directly attached and secured to the base cooling module
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Heat Transfer ProcessIGBT → Evaporator → Refrigerant → Condenser → Ambient air
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Heat Exchange CapacityFrom 50W to 500W





