Hotline:4008-058-338
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Compact B-to-A Thermosyphon System — Compact Thermosyphon Solution engineered specifically for chip cooling, delivering efficient temperature management. Utilizing a pump-free self-circulating system, it ensures energy-efficient operation while eliminating condensation risks. This design offers superior safety and stability compared to thermoelectric cooling.

Product Parameters
  • Main Applications

    Cooling for small semiconductor chips, Hot-side heat dissipation of thermoelectric coolers, Server chip cooling

  • System Features

    Compact size, ideal for single-chip cooling solutions, Chip is directly attached and secured to the base cooling module

  • Heat Transfer Process
    IGBT Evaporator Refrigerant Condenser Ambient air
  • Heat Exchange Capacity
    From 50W to 500W
Product Advantages

  • Designed specifically for chip heat dissipation

  • Pump-free, high reliability
  • Energy-saving and eco-friendly
  • Compact size